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2.0mm pitch crimp connector dual row wire housing halogen free PHB wire-to-board connector

Dongguan Xinpei Plastic & Metal Electronic Co. Ltd
Dongguan Xinpei Plastic & Metal Electronic Co. Ltd
City: Dongguan
Province/State: Guangdong
Country/Region: China
Tel: 86-769-82109962-82616722
Contact Person:
Mr Ricky Zou

2.0mm pitch crimp connector dual row wire housing halogen free PHB wire-to-board connector

Brand Name : HRT
Model Number : A2008HB-NP
Certification : ISO9001/ ISO14001/UL/RoHS/REACH
Place of Origin : Dongguan, China(mainland)
MOQ : 5000 pcs
Price : negotiated
Payment Terms : TT, Western Union, PayPal, L/C
Supply Ability : 500 K pcs per month
Delivery Time : 5 to 8 working days after payment checked
Packaging Details : Bag with outside carton
Color : White
Pitch : 2.00mm
Suitable terminals : A2008T series
Suitable wafer : A2008W series
Flammability class : UL94V-0
Row number : Dual/double
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1, The specification details

Basic size information
MaterialPA66
Wire rangeAWG28# to 22#
Mating lock to partWith
Wire Termination MethodCrimping
Circuits12 to 40 pins
Wire Insulation Diameter1.50mm Max.
Mounting sideStandard on-Board
Terminals materialPhosphor bronze; tin-plated finish
Electrical properties
Current Rating3A AC, DC
Voltage Rating250V AC, DC
Contact Resistance20mΩ Max
Insulation Resistance1000mΩ min
Withstanding Voltage1000V AC/minute
Mechanical properties
Operating temperature range-25℃ to 85 ℃
Other information please kindly check the following picture.


2, Related demission drawing & teting report


Testing report

5. Mechanical Performance


Test DescriptionProcedureRequirement
5-1Actuator Insertion & Withdrawal ForceInsert and withdraw connectors at the speed rate of 25±3mm / minute.Refer to paragraph 7
5-2Crimping Pull Out ForceFix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)AWG#224.0kgf (Min)
AWG#243.0kgf (Min)
AWG#262.0kgf (Min)
AWG#281.0kgf (Min)
5-3Terminal Insertion Force.Insert the crimped terminal into the housing.1.00kgf (Max.)
5-4Terminal/Housing Retention Force.Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.2.0kgf (Min.)
5-5Pin Retention ForceApply axial push force at the speed rate of 25±3mm / minute1.0kgf (Min.)
5-6DurabilityWhen mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.Contact Resistance 40mΩ (Max.)
5-7Vibration

Amplitude: 1.5mm P-P

Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes.

(Based upon MIL-STD-202 Method 201A)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

Discontinuity 1 μsec.(Max.)

5-8Physical Shock490m/s²{50G},3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)


6. Environmental Performance And Others


Test DescriptionProcedureRequirement
6-1Temperature RiseCarrying rated current load.(Based upon UL 498)30℃(Max.)
6-2Heat Resistance85±2℃, 96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

6-3Cold Resistance-25±3℃,96 hours (Based upon JIS C0020)
6-4Humidity

Temperature: 40±2℃

Relative Humidity : 90~95%

Duration: 96 hours

(Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

Insulation Resistance 1000MΩ (Min.)

Dielectric Withstanding Voltage Must meet 4-3

6-5Temperature Cycling

5 cycles of:

a) -55℃ 30 minutes

b) +85℃ 30 minutes

(Based upon JIS C0025)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

6-6Salt SprayTin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7SO2 Gas

24 hours exposure to 50±5ppm.

SO2 gas at 40±2℃.

6-8NH3 Gas40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
6-9Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes
6-10Resistance to Soldering Heat

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Actuator Insertion/Withdrawal Force

[Unit : kgf]

CircuitsAt InitialCircuitsAt Initial
Insertion (Max.)Withdrawal (Min.)Insertion (Max.)Withdrawal (Min.)
Single0.500.102X117.101.50
2X021.700.602X127.701.60
2X032.300.702X138.301.70
2X042.900.802X148.901.80
2X053.500.902X159.501.90
2X064.101.002X1610.102.00
2X074.701.102X1710.702.10
2X085.301.202X1811.302.20
2X095.901.302X1911.902.30
2X106.501.402X2012.502.40


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